Intel® Xeon® Processor E3-1241 v3 (8M Cache, 3.50 GHz) Mã sản phẩm: E3-1241V3

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    Intel® Xeon® Processor E3-1241 v3 (8M Cache, 3.50 GHz)

General information


Type CPU / Microprocessor
Market segment Server
Family Intel Xeon E3-1200 v3
Model number  ?  E3-1241 v3
CPU part numbers
  • CM8064601575331 is an OEM/tray microprocessor
  • BX80646E31241V3 is a boxed microprocessor
Frequency  ?  3500 MHz
Turbo frequency 3900 MHz (1 core)
3700 MHz (all cores)
Bus speed  ?  5 GT/s DMI
Clock multiplier  ?  35
Package 1150-land Flip-Chip Land Grid Array
Socket Socket 1150 / H3 / LGA1150
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date 2nd quarter 2014
 
S-spec numbers


  ES/QS processors Production processors
Part number QFFL SR1R4
CM8064601575331 + +
 
Architecture / Microarchitecture


Microarchitecture Haswell
Platform Denlow
Processor core  ?  Haswell LGA1150
Core stepping  ?  C0 (QFFL, SR1R4)
Manufacturing process 0.022 micron
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size  ?  4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size  ?  4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • TSX / Transactional Synchronization Extensions
  • EM64T / Extended Memory 64 technology / Intel 64  ? 
  • NX / XD / Execute disable bit  ? 
  • HT / Hyper-Threading technology  ? 
  • TBT 2.0 / Turbo Boost technology 2.0  ? 
  • VT-x / Virtualization technology  ? 
  • VT-d / Virtualization for directed I/O
  • TXT / Trusted Execution technology
Low power features
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology  ? 
 
Integrated peripherals / components


Integrated graphics None
Memory controller
  • The number of controllers: 1
    Memory channels: 2
    Supported memory: DDR3-1333, DDR3-1600
    DIMMs per channel: up to 2
    Maximum memory bandwidth (GB/s): 25.6
    ECC supported: Yes
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 3.0 interface
 
Electrical / Thermal parameters


Thermal Design Power  ?  80 Watt

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