General
information |
Model number
|
W3550 |
CPU part number |
AT80601002112AB
|
Box part number |
BX80601W3550 |
Frequency (MHz)
|
3067 |
Bus speed (MHz)
|
2400 MHz QPI |
Package |
1366-land
Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm) |
Socket |
Socket 1366
|
|
Architecture / Microarchitecture |
Processor core |
Bloomfield |
Core stepping |
D0 (SLBEY) |
Manufacturing process |
0.045 micron |
Data width |
64
bit |
Number of cores |
4 |
Floating Point Unit |
Integrated |
Level 1 cache size
|
4 x 32 KB instruction caches
4 x 32 KB data caches |
Level 2 cache size
|
4 x 256 KB |
Level 3 cache size |
8 MB |
Physical memory (GB) |
24 |
Multiprocessing |
Uniprocessor |
Features |
- MMX
instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1
- SSE4.2
- EM64T technology
- Virtualization technology
- Execute Disable bit
- Turbo Boost Technology
- Hyper-Threading technology
|
Low power features |
- Thread C1/C1E,
C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology
|
On-chip peripherals |
-
Integrated 3-channel DDR3 SDRAM Memory controller
- Quick Path Interconnect
|
|
Electrical/Thermal parameters |
V core (V)
|
0.8 - 1.375 |
Minimum/Maximum operating
temperature (°C)
|
5 - 67.9 |
Minimum/Maximum power dissipation (W)
|
12 (TDP in C6 state) / 224.42 |
Thermal Design Power (W)
|
130 |
|
Notes on Intel
AT80601002112AB |
- Memory controller supports
DDR3-800 and DDR3-1066 memory
|